Martin Thuo, assistant professor of materials science and engineering, and his team have been featured on the cover of the October 2019 issue of Advanced Functional Materials for their recent publication, “Heat-Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices.”
Thuo and his team have developed a heat-free way to make metallic conductive interconnects, which are structures that connect two or more circuit elements together electrically in integrated circuits. The potential applications of this discovery include surface mount and flexible electronics, solar cell devices and soft materials.